Au80Sn20 eutectic solder alloy is widely used in optoelectronic packaging, high-power LED and high reliability electronic devices in military/medical/aerospace field. It has high oxidation resistance, high creep resistance, good wettability, strong welding joint and good thermal conductivity. It is usually manufactured as solder preforms in the connection areas of many package modes, especially the fields requiring high reliability and sealability. But it is very brittle, cannot be manufactured by normal process. Domestic market is almost occupyed by foreign corporation. Bolin material which is a high-tech company successfully developed a productionable process to produce Au80Sn20 solder preforms and manufactured a series of machines which dedicated for Au80Sn20(Got patent already). the quality of our solder preforms is comparable with overseas products like Coining, Indium.