Products
SAC105/SAC305/SAC405 Solder Preforms
作者:Admin 来源:BMC 发布时间:2011-07-18
Sn/Ag/Cu Solder Preforms
Sn-Ag-Cu series alloys are mostly used in SMT technology currently. As one member of this family, SAC305 has the best wettability, low melt point, antifatigue and high reliability. It is widely manufactured as solder preform/foil/wire applicated in electronic package soldering. Take SAC305 for example, its property as below:
Alloy |
Solidus |
Liquidus |
Suggested soldering Temperature |
density |
tensile strength |
Thermal conductivity |
coefficient of thermal expansion |
SAC305 |
217 |
218 |
>260 |
7.40 |
50 |
34 |
21 |
BMC is able to provide any customized shape/thickness SAC solder preform. Take SAC305 for example, its parameters as below table:
Properties of Sn96.5Ag3Cu0.5 solder preform |
|
Sn96.5Ag3Cu0.5 impurity |
<0.1% (wt%) |
Min. Melt point drift |
+/-1°C |
Min. thickness |
0.01mm+/-0.005mm |
Min. tolerance |
0.005mm |
Storage and pack of Sn96.5Ag3Cu0.5 solder preform |
|
Storage temperature |
25+-3°C |
Storage humidity |
<40RH |
Pack type |
Customized packing |
Welding parameters of Sn96.5Ag3Cu0.5 solder preform |
|
Weld type |
Flux needed,or welding under reducing atmosphere or vacuum |
Preheat temperature |
>120°C |
Preheat time |
>10s |
Welding temperature |
>260°C |
Welding time |
>10s |