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SAC105/SAC305/SAC405 Solder Preforms

作者:Admin 来源:BMC 发布时间:2011-07-18


Sn/Ag/Cu Solder Preforms




    Sn-Ag-Cu series alloys are mostly used in SMT technology currently. As one member of this family, SAC305 has the best wettability, low melt point, antifatigue and high reliability. It is widely manufactured as solder preform/foil/wire applicated in electronic package soldering. Take SAC305 for example, its property as below:

Alloy

Solidus
(°C)

Liquidus
(°C)

Suggested soldering Temperature 
(°C)

density
(g/cm3)

tensile strength
(MPa)

Thermal conductivity
(w/m×°C)

coefficient of thermal expansion
(×10-6/°C
)

SAC305

217

218

>260

7.40

50

34

21


     BMC is able to provide any customized shape/thickness SAC solder preform. Take SAC305 for example, its parameters as below table:
 

Properties of Sn96.5Ag3Cu0.5 solder preform

Sn96.5Ag3Cu0.5 impurity

<0.1% (wt%)

Min. Melt point drift

+/-1°C

Min. thickness

0.01mm+/-0.005mm

Min. tolerance

0.005mm

Storage and pack of Sn96.5Ag3Cu0.5 solder preform

Storage temperature

25+-3°C

Storage humidity

<40RH

Pack type

Customized packing

Welding parameters of Sn96.5Ag3Cu0.5 solder preform

Weld type

Flux needed,or welding under reducing atmosphere or vacuum

Preheat temperature

>120°C

Preheat time

>10s

Welding temperature

>260°C

Welding time

>10s


 

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