Products
Pb37Sn63/Pb92.5In5Ag2.5 Solder Preforms
作者：Admin 来源：BMC 发布时间：2011-07-18
Pb based Solder Preforms
Sn-Pb alloy has very good stress release ability, big melt point chosen window (183 -327°C), and low cost. It is traditional solder for SMT technology. Below shows Sn63Pb37 eutectic alloy properties.
|
Alloy |
Solidus |
Liquidus |
Suggested soldering Temperature |
density |
tensile strength |
Thermal conductivity |
coefficient of thermal expansion |
|
Sn63Pb37 |
183 |
183 |
223 |
8.34 |
51.7 |
51 |
25 |
BMC is able to provide any customized shape/thickness Sn-Pb solder preform. Take Sn63Pb37 for example.
|
Properties of Sn63Pb37 solder preform |
|
|
Sn63Pb37 impurity |
<0.1% (wt%) |
|
Min. Melt point drift |
+/-1°C |
|
Min. thickness |
0.01mm+/-0.005mm |
|
Min. tolerance |
0.005mm |
|
Storage and pack of Sn63Pb37 solder preform |
|
|
Storage temperature |
25+-3°C |
|
Storage humidity |
<40RH |
|
Pack type |
Customized packing |
|
Welding parameters of Sn63Pb37 solder preform |
|
|
Weld type |
Flux needed，or welding under reducing atmosphere or vacuum |
|
Preheat temperature |
>100°C |
|
Preheat time |
>10s |
|
Welding temperature |
>223°C |
|
Welding time |
>10s |