Company News
Bolin Material will attend year 2012 14th COIE
作者:Admin 来源:BMC 发布时间:2012-07-18
Bolin material will attend year 2012 14th China optoelectronic international exhibition in Shenzhen, sincerely invite you to join and communicate with us.
When: 2012.9.6 to 2012.9.9
Where: Shenzhen exhibition center
Exhibition stand #: No. 6326 in 6th Hall
Exhibited products: solder preforms /foils/wires in optoelectronic package, including popular solder material Au80Sn20, In-Sn-Ag, SAC and etc.