Company News

Bolin Material will attend year 2012 14th COIE

作者:Admin 来源:BMC 发布时间:2012-07-18


Bolin material will attend year 2012 14th China optoelectronic international exhibition in Shenzhen, sincerely invite you to join and communicate with us.
When:  2012.9.6 to 2012.9.9
Where: Shenzhen exhibition center
Exhibition stand #: No. 6326 in 6th Hall
Exhibited products: solder preforms /foils/wires in optoelectronic package, including popular solder material Au80Sn20, In-Sn-Ag, SAC and etc.


 

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