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Ag/Cu based Solder Preforms
作者：Admin 来源：BMC 发布时间：2011-07-18
Ag/Cu based Solder Preforms
Ag/Cu based solder preforms are a typical high temperature solder which is usually allpicated in metal/cermetic/glass soldering. Soldering temperatures are from 700 to 900 degrees. it has good soldering strength and good wettablity. BMC can produce any solder preforms shape based on customer's requirements. Take Ag-Cu eutectic alloy (Ag72Cu28) as example in below property table.
| Properties of Ag72Cu28 solder preform | |
|
Ag72Cu28 impurity |
<0.1% (wt%) |
|
Min. Melt point drift |
+/-1°C |
|
Min. thickness |
0.05mm+/-0.005mm |
|
Min. tolerance |
0.005mm |
| Storage and pack of Ag72Cu28 solder preform | |
| Storage temperature | 25+-3°C |
| Storage humidity | <40RH |
| Pack type | Customized packing |
| Welding parameters of Ag72Cu28 solder preform | |
| Weld type | Flux needed，or welding under reducing atmosphere or vacuum |
| Welding temperature | <880°C |
| Welding time | >10s |
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