Bolin Materials Corporation

    Bolin Materials corporation(BMC) is a cooperative enterprise of Wuhan University of Technology with ISO9001 quality system certificated, which locates in Shanwei, Guangdong. WHUT and Bolin have set up a solders lab together to research new solders and their applications.
    BMC focuses on the development and manufacture of alloy solder preform, ribbon and wire that used in electronic packaging and assembly. Leveraging our technical know-how on metal alloy material through years of cooperation with institution and industries we could build customized parts for various applications such as high power LED, LD chip soldering, hermetic housing sealing, solar cell panel and fiber-optics component soldering.
    We are readily offering fast response to whatever design you need. Just simply let us know your application and we commit ourselves to work out a suitable solution for you! 
 

Tel:  (+86) 0660-6782773  Fax:  (+86) 0660-6782776  Email: customerservice@bolinmaterial.com
 Address：Building A, No.23, Meilong, Shanwei, Guangdong, China