BMC successfully attended year 2012 14^th China optoelectronic international exhibition in Shenzhen. We introduced Bolin Material and its products to grand public, and discussed with customers/audiences on solder selection and welding technilogy of electronic packaging area. We always focus on soldering solution based on each customer's own sitiation. Meanwhile we also try to perfect our products, optimize our service through technical communication with customers, to achieve win-win.