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Sn90Sb10/Sn97.5Sb2.5 Solder Preforms

作者:Admin 来源:BMC 发布时间:2011-07-18


Sn-Sb Solder Preforms


    Sn-Sb alloy solder has excellent wettability, strong solder joint, high reliability, usually be used in some special packaging. Take Sn90Sb10 for example as below:
 

Alloy

Solidus
(°C)

Liquidus
(°C)

Suggested soldering Temperature 
(°C)

density
(g/cm3)

tensile strength
(MPa)

Thermal conductivity
(w/m×°C)

coefficient of thermal expansion
(×10-6/°C)

Sn90Sb10

240

250

282

8.41

44

42

27


    BMC is able to provide any customized shape/thickness Sn-Sb solder preform. Take Sn90Sb10 for example, its parameters as below table:

Properties of Sn90Sb10 solder preform

Sn90Sb10 impurity

<0.1% (wt%)

Min. Melt point drift

+/-1°C

Min. thickness

0.01mm+/-0.005mm

Min. tolerance

0.005mm

Storage and pack of Sn90Sb10 solder preform

Storage temperature

25+-3°C

Storage humidity

<40RH

Pack type

Customized packing

Welding parameters of Sn90Sb10 solder preform

Weld type

Flux needed,or welding under reducing atmosphere or vacuum

Preheat temperature

>120°C

Preheat time

>10s

Welding temperature

>282°C

Welding time

>10s


 

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