Products
Sn90Sb10/Sn97.5Sb2.5 Solder Preforms
作者:Admin 来源:BMC 发布时间:2011-07-18
Sn-Sb Solder Preforms
Sn-Sb alloy solder has excellent wettability, strong solder joint, high reliability, usually be used in some special packaging. Take Sn90Sb10 for example as below:
Alloy |
Solidus |
Liquidus |
Suggested soldering Temperature |
density |
tensile strength |
Thermal conductivity |
coefficient of thermal expansion |
Sn90Sb10 |
240 |
250 |
282 |
8.41 |
44 |
42 |
27 |
BMC is able to provide any customized shape/thickness Sn-Sb solder preform. Take Sn90Sb10 for example, its parameters as below table:
Properties of Sn90Sb10 solder preform |
|
Sn90Sb10 impurity |
<0.1% (wt%) |
Min. Melt point drift |
+/-1°C |
Min. thickness |
0.01mm+/-0.005mm |
Min. tolerance |
0.005mm |
Storage and pack of Sn90Sb10 solder preform |
|
Storage temperature |
25+-3°C |
Storage humidity |
<40RH |
Pack type |
Customized packing |
Welding parameters of Sn90Sb10 solder preform |
|
Weld type |
Flux needed,or welding under reducing atmosphere or vacuum |
Preheat temperature |
>120°C |
Preheat time |
>10s |
Welding temperature |
>282°C |
Welding time |
>10s |