Products
In/In97Ag3/In52Sn48/In66Bi34 Solder Preforms
作者:Admin 来源:BMC 发布时间:2011-07-18
Indium based Solder Preforms
Melt point of pure Indium is low, boiling point is high. In has good corrosion resistance for alkali and saline solution. Wettability of In is also good, be able to wet most materials including metal and nonmetal, so it is usually used as low temperature solder. In based solders are popular solder material in e-packaging, since it has many advantages compared with others, like: low melt point, antifatigue, good ductivity, high conductivity, strong solder joint, high reliability and good wettability with ceramic, glass and other nonmetal. In97Ag3 and In52Sn48 are typical In based solder alloy.
Properties of In alloy as below table:
Alloy |
Solidus |
Liquidus |
Suggested soldering Temperature |
density |
tensile strength |
Thermal conductivity |
coefficient of thermal expansion |
In |
156 |
156 |
>187 |
7.31 |
1.88 |
86 |
29 |
Alloy |
Solidus |
Liquidus |
Suggested soldering Temperature |
density |
tensile strength |
Thermal conductivity |
coefficient of thermal expansion |
In97Ag3 |
144 |
144 |
>185 |
7.38 |
5.51 |
73 |
22 |
Alloy |
Solidus |
Liquidus |
Suggested soldering Temperature |
density |
tensile strength |
Thermal conductivity |
coefficient of thermal expansion |
In52Sn48 |
118 |
118 |
>148 |
7.3 |
12 |
34 |
20 |
BMC is able to provide any customized shape/thickness In-based alloy solder preform. Take In97Ag3 for example, its parameters as below table:
Properties of In97Ag3 solder preform |
|
In97Ag3 impurity |
<0.1% (wt%) |
Min. Melt point drift |
+/-1°C |
Min. thickness |
0.02mm+/-0.005mm |
Min. tolerance |
0.005mm |
Storage and pack of In97Ag3 solder preform |
|
Storage temperature |
25+-3°C |
Storage humidity |
<40RH |
Pack type |
Customized packing |
Welding parameters of In97Ag3 solder preform |
|
Weld type |
Flux needed,or welding under reducing atmosphere or vacuum |
Preheat temperature |
>100°C |
Preheat time |
>10s |
Welding temperature |
>185°C |
Welding time |
>10s |