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Au80Sn20/Au88Ge12/Au97Si3 solder preforms

作者:Admin 来源:BMC 发布时间:2011-07-18

Gold based Solder Preforms


    BMC provides kinds of Gold based eutectic alloy solder preforms, such as Au80Sn20, Au88Ge12, Au96.85Si3.15, Au80Cu20.

 


Au80Sn20 Solder Preforms




Au88Ge12 Solder Preforms




Au96.85Si3.15 Solder Preforms


 
Au80Sn20 Solder Preforms:
 
 
    Au80Sn20 eutectic solder alloy is widely used in optoelectronic packaging, high-power LED and high reliability electronic devices in military/medical/aerospace field. It has high oxidation resistance, high creep resistance, good wettability, strong welding joint and good thermal conductivity. It is usually manufactured as solder preforms in the connection areas of many package modes, especially the fields requiring high reliability and sealability. Its majority ;properties as below table:
 

 
Alloy
Solidus
(°C)
Liquidus
(°C)
Suggested soldering Temperature 
(°C)
density
(g/cm3)
tensile strength
(MPa)
Thermal conductivity
(w/m·°C)
coefficient of thermal expansion
(×10-6/°C)
Au80Sn20
280
280
>320
14.51
276
57
16

    Since Au80Sn20 is eutectic alloy, solidus and liquidus are the same. From its phase diagram, we can see that the melt point would change a lot once composition changes, so that impact soldering quality. Hence composition control is pretty key for final products.

    BMC is able to provide any customized shape/thickness Au80Sn20 solder preforms. Parameters of Au80Sn20 solder preforms as below table:
 
Properties of Au80Sn20 solder preform
Au80Sn20 impurity
<0.1% (wt%)
Min. Melt point drift
+/-1°C
Min. thickness
0.015mm+/-0.005mm
Min. tolerance
0.005mm
Storage and pack of Au80Sn20 solder preform
Storage temperature
25+-3°C
Storage humidity
<40RH
Pack type
Customized packing
Welding parameters of Au80Sn20 solder preform
Weld type
No flux needed,but welding under reducing atmosphere or vacuum can provide better solder quality
Preheat temperature
No need due to no flux added
Preheat time
N/A
Welding temperature
>320°C
Welding time
>10s


 

 

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