Company News

BMC Successfully Attended SEMICON China Expo in Shanghai

作者:Davi 来源:BMC 发布时间:2013-04-01

    BMC has successfully attended 25th SEMICON CHINA EXPO in Shanghai in March'13. In this expo, BMC brought more new solder preforms/wires/foils/ribbons, including Au96.85Si3.15 preform, Au88Ge12 preform, Ag72Cu28 wire and ribbon. Many customers and visits paid great interesting on these new products and discussed with BMC booth engineers on soldering process. In those discussions, BMC engineers raised some new ideas and methods, which drawed much attentions from visitors, including customers and University Professors.
 


 

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