Products
BMC focuses on the development and manufacture of alloy solder preforms, foil and wire that using in electronic packaging and assembly. We can provide a series of solder alloys with different melt points from 50 to 1000°C (including popular Au80Sn20 Gold-Tin eutectic alloy solder preforms). Please refer to below table for details:
| Alloy | Density (g/cm3) | Solidus (°C) | Eutectic T (°C) | Liquidus (°C) |
| Bi49In21Pb18Sn12 | 9.01 | 58 | ||
| In66.3Bi33.7 | 8 | 73 | ||
| Bi57In26Sn17 | 8.54 | 79 | ||
| In52Sn48 | 7.3 | 120 | 122 | |
| In74.7Cd25.3 | 7.73 | 127 | ||
| Bi57Sn43 | 8.54 | 139 | ||
| In97Ag3 | 7.38 | 144 | ||
| In100 | 7.31 | 156 | ||
| Sn77.2In20Ag2.8 | 7.36 | 175 | 187 | |
| Sn67.75Cd32.25 | 7.69 | 176 | ||
| Sn63Pb37 | 8.37 | 183 | ||
| Sn91.2Zn8.8 | 7.28 | 199 | ||
| Sn90Au10 | 7.77 | 217 | ||
| Sn96.5Ag3Cu0.5 | 7.37 | 217 | 218 | |
| Sn96.5Ag3.5 | 7.37 | 221 | ||
| Sn100 | 7.31 | 232 | ||
| Sn90Sb10 | 7.22 | 240 | 250 | |
| Au80Sn20 | 14.52 | 280 | ||
| Au60Ag20Sn20 | 12.89 | 280 | 475 | |
| Pb93Sn7 | 10.94 | 285 | 310 | |
| Pb90Sn5Ag5 | 10.99 | 292 | ||
| Pb95In5 | 11.04 | 292 | 314 | |
| Pb97.5Ag2.5 | 11.32 | 304 | ||
| Pb92.5In5Ag2.5 | 11.01 | 307 | ||
| Au88Ge12 | 14.67 | 356 | ||
| Au96.85Si3.15 | 15.7 | 363 | ||
| Ag60Cu30Sn10 | 9.57 | 600 | 720 | |
| Ag72Cu28 | 10.01 | 779 | ||
| Ag80Cu20 | 10.14 | 779 | 815 | |
| Ag50Cu50 | 9.67 | 779 | 870 | |
| Ag90Cu10 | 10.31 | 779 | 873 | |
| Ag92Cu8 | 10.35 | 779 | 888 | |
| Cu70Ag30 | 10.31 | 779 | 945 | |
| Au60Ag20Cu20 | 13.79 | 835 | 845 | |
| Au80Cu20 | 15.67 | 910 | ||
| Au50Cu50 | 12.22 | 955 | 970 | |
| Ag100 | 10.49 | 961 | ||
| Ag50Au50 | 13.59 | 1000 | 1020 | |
| Au69Ag25Pt6 | 16.04 | 1040 | 1115 | |
| Au100 | 19.3 | 1063 | ||
| Cu100 | 8.96 | 1083 |